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- ADN4691EBRZ - ADI
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Manufacturer:ADI
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ManyChip's Part#:MC415200
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Category:Interface IC, Interface Controller
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Package:SOIC-8
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Datasheet:Datasheet 3D Model
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Description:ANALOG DEVICES ADN4691EBRZ LVDS Driver, Half Duplex, LVDS Transceiver, 130 ps, 24mA, -40℃, 85℃, 3V
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Stock Locations:
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Availability:267 pcs In Stock
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MOQ:1 pcs
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Unit Price:$ 6.06
Updated at 01/11/2025 10:30:15(UTC+8)
Certifications
ManyChip is committed to product quality and safety with ISO 9001, ISO 13485, ISO 45001, UL, RoHS, CQC and REACH certifications.
Description
- Product Details
- The ADN4691E/ADN4693E/ADN4696E/ADN4697E are multipoint, low voltage differential signaling (M-LVDS) transceivers (driver and receiver pairs) that can operate at up to 200 Mbps (100 MHz). The receivers detect the bus state with a differential input of as little as 50 mV over a common-mode voltage range of −1 V to +3.4 V. ESD protection of up to ±15 kV is implemented on the bus pins. The devices adhere to the TIA/EIA-899 standard for M-LVDS and complement TIA/EIA- 644 LVDS devices with additional multipoint capabilities.
- The ADN4691E/ADN4693E are Type 1 receivers with 25 mV of hysteresis so that slow-changing signals or loss of input does not lead to output oscillations. The ADN4696E/ADN4697E are Type 2 receivers exhibiting an offset threshold, guaranteeing the output state when the bus is idle (bus-idle fail-safe) or the inputs are open (open-circuit fail-safe).
- The devices are available as half-duplex in an 8-lead SOIC package (the ADN4691E/ADN4696E) or as full-duplex in a 14-lead SOIC package (the ADN4693E/ADN4697E).
- Applications
- Backplane and cable multipoint data transmission
- Multipoint clock distribution
- Low power, high speed alternative to shorter RS-485 links
- Networking and wireless base station infrastructure
- ### Features and Benefits
- Multipoint LVDS transceivers (low voltage differential signaling driver and receiver pairs)
- Switching rate: 200 Mbps (100 MHz)
- Supported bus loads: 30 Ω to 55 Ω
- Type 1 receiver type: hysteresis of 25 mV
- Conforms to TIA/EIA-899 standard for M-LVDS
- Glitch free power-up/power-down on M-LVDS bus
- Controlled transition times on driver output
- Common-mode range: −1 V to +3.4 V, allowing communication with 2 V of ground noise
- Driver outputs high-Z when disabled or powered off
- See data sheet for additional features
ADN4691EBRZ Specifications
| Attribute | Attribute Value |
|---|---|
| Datasheet | Datasheet |
| 3D Model | 3D Model |
| Mounting Style | Surface Mount |
| Number of Pins | 8 Pin |
| Case/Package | SOIC-8 |
| Supply Voltage (DC) | 3.00V (min) |
| Supply Current | 16 mA |
| Number of Positions | 8 Position |
| Input Current (Min) | 32 μA |
| Operating Temperature (Max) | 85 ℃ |
| Operating Temperature (Min) | -40 ℃ |
| Supply Voltage | 3.3 V |
| Supply Voltage (Max) | 3.6 V |
| Supply Voltage (Min) | 3 V |
| Show | |
| Size-Width | 4 mm |
| Operating Temperature | -40℃ ~ 85℃ |
| Product Lifecycle Status | Active |
| Packaging | Each |
| RoHS | RoHS Compliant |
| Lead-Free Status | Lead Free |
| REACH SVHC Compliance | No SVHC |
| REACH SVHC Compliance Edition | 2015/12/17 |
| ECCN Code | 5A991.b |
Order guide
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charges, duties and taxes.
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- You can choose whether shipping charges will be charged through your shipping account or by us.
- Please confirm with the logistics company in advance for remote areas.
(Additional charges ($35-$50) may apply for delivery in these areas)
- Delivery date: usually 2 to 7 working days.
- A tracking number will be sent after your order ships.
- - Carefully inspected and packed by ManyChip warehouse - Vacuum packaging - Anti-static packaging - Shockproof foam
- The terms here are for reference only, the actual terms are subject to the sales quotation. - Please confirm product specifications when ordering. - MOQ refers to the minimum order quantity required to purchase each part. - If you have special ordering instructions, please indicate them on the ordering page. - Inspection (PSI) will be performed prior to shipment.
- - Income Quality Control (IQC), 1000+ qualified dealers. - Chips are tested by authoritative organizations to ensure the quality, authenticity and safety of your device. - Decapsulation control - X-ray control - XRF inspection - Electrical testing - Surface testing -Digital components warehouse, covering an area of 800 square meters, with constant temperature and humidity
Contact Us
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