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- SMOMAPL138BGWTA3R - TI
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Manufacturer:TI
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ManyChip's Part#:MC26050062
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Category:DSP, Digital Signal Processor
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Package:LFBGA-361
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Datasheet:Datasheet 3D Model
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Description:DSP Fixed-Point/Floating-Point 375MHz 361Pin BGA T/R
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Stock Locations:
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Availability:1,310 pcs In Stock
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MOQ:1 pcs
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Unit Price:$ 76.78
Updated at 17/06/2025 10:30:15(UTC+8)
Certifications
ManyChip is committed to product quality and safety with ISO 9001, ISO 13485, ISO 45001, UL, RoHS, CQC and REACH certifications.
Description
- This device is a Low-power applications processor based on an ARM926EJ-S and a C674x DSP core. It provides significantly lower power than other members of the TMS320C6000 platform of DSPs.
- This device enables OEMs and ODMs to quickly bring to market devices featuring robust operating systems support, rich user interfaces, and high processing performance life through the maximum flexibility of a fully integrated mixed processor solution.
- The dual-core architecture of the device provides benefits of both DSP and Reduced Instruction Set Computer (RISC) technologies, incorporating a high-performance TMS320C674x DSP core and an ARM926EJ-S core.
- The ARM926EJ-S is a 32-bit RISC processor core that performs 32-bit or 16-bit instructions and processes 32-bit, 16-bit, or 8-bit data. The core uses pipelining so that all parts of the processor and memory system can operate continuously.
- The ARM core has a coprocessor 15 (CP15), protection module, and Data and program Memory Management Units (MMUs) with table look-aside buffers. It has separate 16K-byte instruction and 16K-byte data caches. Both are four-way associative with virtual index virtual tag (VIVT). The ARM core also has a 8KB RAM (Vector Table) and 64KB ROM.
- The device DSP core uses a two-level cache-based architecture. The Level 1 program cache (L1P) is a 32KB direct mapped cache and the Level 1 data cache (L1D) is a 32KB 2-way set-associative cache. The Level 2 program cache (L2P) consists of a 256KB memory space that is shared between program and data space. L2 memory can be configured as mapped memory, cache, or combinations of the two. Although the DSP L2 is accessible by ARM and other hosts in the system, an additional 128KB RAM shared memory is available for use by other hosts without affecting DSP performance.
- The peripheral set includes: a 10/100 Mb/s Ethernet MAC (EMAC) with a Management Data Input/Output (MDIO) module; one USB2.0 OTG interface; one USB1.1 OHCI interface; two inter-integrated circuit (I2C) Bus interfaces; one multichannel audio serial port (McASP) with 16 serializers and FIFO buffers; two multichannel buffered serial ports (McBSP) with FIFO buffers; two SPI interfaces with multiple chip selects; four 64-bit general-purpose timers each configurable (one configurable as watchdog); a configurable 16-bit host port interface (HPI) ; up to 9 banks of 16 pins of general-purpose input/output (GPIO) with programmable interrupt/event generation modes, multiplexed with other peripherals; three UART interfaces (each with RTS and CTS); two enhanced high-resolution pulse width modulator (eHRPWM) peripherals; 3 32-bit enhanced capture (eCAP) module peripherals which can be configured as 3 capture inputs or 3 auxiliary pulse width modulator (APWM) outputs; and 2 external memory interfaces: an asynchronous and SDRAM external memory interface (EMIFA) for slower memories or peripherals, and a higher speed DDR2/Mobile DDR controller.
- The Ethernet Media Access Controller (EMAC) provides an efficient interface between the device and a network. The EMAC supports both 10Base-T and 100Base-TX, or 10 Mbits/second (Mbps) and 100 Mbps in either half- or full-duplex mode. Additionally an Management Data Input/Output (MDIO) interface is available for PHY configuration. The EMAC supports both MII and RMII interfaces.
- The SATA controller provides a high-speed interface to mass data storage devices. The SATA controller supports both SATA I (1.5 Gbps) and SATA II (3.0 Gbps).
- The Universal Parallel Port (uPP) provides a high-speed interface to many types of data converters, FPGAs or other parallel devices. The UPP supports programmable data widths between 8- to 16-bits on each of two channels. Single-data rate and double-data rate transfers are supported as well as START, ENABLE and WAIT signals to provide control for a variety of data converters.
- A Video Port Interface (VPIF) is included providing a flexible video input/output port.
- The rich peripheral set provides the ability to control external peripheral devices and communicate with external processors. For details on each of the peripherals, see the related sections later in this document and the associated peripheral reference guides.
- This device has a complete set of development tools for the ARM and DSP. These include C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a Windows™ debugger interface for visibility into source code execution.
SMOMAPL138BGWTA3R Specifications
| Attribute | Attribute Value |
|---|---|
| Datasheet | Datasheet |
| 3D Model | 3D Model |
| Mounting Style | Surface Mount |
| Number of Pins | 361 Pin |
| Case/Package | LFBGA-361 |
| RAM Memory Size | 128 KB |
| Number of UARTs | 3 UART |
| Operating Temperature (Max) | 105 ℃ |
| Operating Temperature (Min) | -40 ℃ |
| Show | |
| Operating Temperature | -40℃ ~ 105℃ (TJ) |
| Product Lifecycle Status | Active |
| Packaging | Tape & Reel (TR) |
| RoHS | Non-Compliant |
| Lead-Free Status | Contains Lead |
| ECCN Code | 3A991.a.2 |
Order guide
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- Please confirm with the logistics company in advance for remote areas.
(Additional charges ($35-$50) may apply for delivery in these areas)
- Delivery date: usually 2 to 7 working days.
- A tracking number will be sent after your order ships.
- - Carefully inspected and packed by ManyChip warehouse - Vacuum packaging - Anti-static packaging - Shockproof foam
- The terms here are for reference only, the actual terms are subject to the sales quotation. - Please confirm product specifications when ordering. - MOQ refers to the minimum order quantity required to purchase each part. - If you have special ordering instructions, please indicate them on the ordering page. - Inspection (PSI) will be performed prior to shipment.
- - Income Quality Control (IQC), 1000+ qualified dealers. - Chips are tested by authoritative organizations to ensure the quality, authenticity and safety of your device. - Decapsulation control - X-ray control - XRF inspection - Electrical testing - Surface testing -Digital components warehouse, covering an area of 800 square meters, with constant temperature and humidity
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