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Updated at 01/11/2025 10:30:15(UTC+8)
Certifications
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Description
- The IRFH7004TRPBF is a HEXFET® single N-channel Power MOSFET offers improved gate, avalanche and dynamic dV/dt ruggedness. It is suitable for battery powered circuits, half-bridge and full-bridge topologies, synchronous rectifier applications, DC-to-AC inverters, DC-to-DC and AC-to-DC converters.
- Fully characterized capacitance and avalanche SOA
- Enhanced body diode dV/dt and di/dt capability
IRFH7004TRPBF Specifications
| Attribute | Attribute Value |
|---|---|
| Datasheet | Datasheet |
| 3D Model | 3D Model |
| Mounting Style | Surface Mount |
| Number of Pins | 8 Pin |
| Case/Package | PQFN-8 |
| Number of Channels | 1 Channel |
| Number of Positions | 5 Position |
| Drain to Source Resistance (on) (Rds) | 0.0011 Ω |
| Polarity | N-Channel |
| Power Dissipation | 156 W |
| Threshold Voltage | 3 V |
| Input Capacitance | 6419 pF |
| Drain to Source Voltage (Vds) | 40 V |
| Breakdown Voltage (Drain to Source) | 40 V |
| Continuous Drain Current (Ids) | 259A |
| Rise Time | 51 ns |
| Input Capacitance (Ciss) | 6419pF @25V(Vds) |
| Input Power (Max) | 156 W |
| Fall Time | 49 ns |
| Operating Temperature (Max) | 150 ℃ |
| Operating Temperature (Min) | -55 ℃ |
| Power Dissipation (Max) | 156W (Tc) |
| Show | |
| Size-Length | 6 mm |
| Size-Width | 5 mm |
| Size-Height | 0.85 mm |
| Material | Silicon |
| Operating Temperature | -55℃ ~ 150℃ (TJ) |
| Product Lifecycle Status | Active |
| Packaging | Tape & Reel (TR) |
| RoHS | RoHS Compliant |
| Lead-Free Status | Lead Free |
| REACH SVHC Compliance Edition | 2015/12/17 |
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- - Carefully inspected and packed by ManyChip warehouse - Vacuum packaging - Anti-static packaging - Shockproof foam
- The terms here are for reference only, the actual terms are subject to the sales quotation. - Please confirm product specifications when ordering. - MOQ refers to the minimum order quantity required to purchase each part. - If you have special ordering instructions, please indicate them on the ordering page. - Inspection (PSI) will be performed prior to shipment.
- - Income Quality Control (IQC), 1000+ qualified dealers. - Chips are tested by authoritative organizations to ensure the quality, authenticity and safety of your device. - Decapsulation control - X-ray control - XRF inspection - Electrical testing - Surface testing -Digital components warehouse, covering an area of 800 square meters, with constant temperature and humidity
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