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Updated at 17/06/2025 10:30:15(UTC+8)
Certifications
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Description
- * High-Performance Static CMOS Technology * 150 MHz (6.67-ns Cycle Time) * Low-Power (1.8-V Core at 135 MHz, 1.9-V Core at 150 MHz, 3.3-V I/O) Design * JTAG Boundary Scan Support IEEE Standard 1149.1-1990 IEEE Standard Test Access Port and Boundary-Scan Architecture * High-Performance 32-Bit CPU (TMS320C28x) * 16 x 16 and 32 x 32 MAC Operations * 16 x 16 Dual MAC * Harvard Bus Architecture * Atomic Operations * Fast Interrupt Response and Processing * Unified Memory Programming Model * 4M Linear Program/Data Address Reach * Code-Efficient (in C/C++ and Assembly) * TMS320F24x/LF240x Processor Source Code Compatible * On-ChipMemory * Flash Devices: Up to 128K x 16 Flash (Four 8K x 16 and Six 16K x 16 Sectors) * ROM Devices: Up to 128K x 16 ROM * 1K x 16 OTP ROM * L0 and L1: 2 Blocks of 4K x 16 Each Single-Access RAM (SARAM) * H0: 1 Block of 8K x 16 SARAM * M0 and M1: 2 Blocks of 1K x 16 Each SARAM * Boot ROM (4K x16) * With Software Boot Modes * Standard Math Tables * External Interface(2812) * Over 1M x 16 Total Memory * Programmable Wait States * Programmable Read/Write Strobe Timing * Three Individual Chip Selects * Endianness: Little Endian * Clock and SystemControl * Dynamic PLL Ratio Changes Supported * On-Chip Oscillator * Watchdog Timer Module * Three ExternalInterrupts * Peripheral Interrupt Expansion (PIE) Block That Supports 45Peripheral Interrupts * Three 32-Bit CPU-Timers * 128-BitSecurity Key/Lock * Protects Flash/ROM/OTP and L0/L1 SARAM * Prevents Firmware Reverse-Engineering * Motor ControlPeripherals * Two Event Managers (EVA, EVB) * Compatible to 240xA Devices * Serial PortPeripherals * Serial Peripheral Interface (SPI) * Two Serial Communications Interfaces (SCIs), Standard UART * Enhanced Controller Area Network (eCAN) * Multichannel Buffered Serial Port (McBSP) * 12-Bit ADC, 16Channels * 2 x 8 Channel Input Multiplexer * Two Sample-and-Hold * Single/Simultaneous Conversions * Fast Conversion Rate: 80 ns/12.5 MSPS * Up to 56General-Purpose I/O (GPIO) Pins * Advanced EmulationFeatures * Analysis and Breakpoint Functions * Real-Time Debug via Hardware * Development ToolsInclude * ANSI C/C++ Compiler/Assembler/Linker * Code Composer Studio IDE * DSP/BIOS * JTAG Scan Controllers(1) * Low-PowerModes and Power Savings * IDLE, STANDBY, HALT Modes Supported * Disable Individual Peripheral Clocks * PackageOptions * 179-Ball MicroStar BGA With External Memory Interface (GHH, ZHH) (2812) * 176-Pin Low-Profile Quad Flatpack (LQFP) With External Memory Interface (PGF) (2812) * 128-Pin LQFP Without External Memory Interface (PBK) (2810, 2811) * Temperature Options * A: –40°C to 85°C (GHH, ZHH, PGF, PBK) * S: –40°C to 125°C (GHH, ZHH, PGF, PBK) * Q: –40°C to 125°C (PGF, PBK) [Q100 Qualification]
TMS320F2812GHHA Specifications
| Attribute | Attribute Value |
|---|---|
| Datasheet | Datasheet |
| 3D Model | 3D Model |
| Mounting Style | Surface Mount |
| Number of Pins | 179 Pin |
| Case/Package | BGA-179 |
| Frequency | 150 MHz |
| Supply Voltage (DC) | 1.81V (min) |
| Number of Positions | 179 Position |
| Clock Speed | 150 MHz |
| RAM Memory Size | 18K x 16 |
| Number of Bits | 32 Bit |
| FLASH Memory Size | 256 KB |
| Number of I/O Pins | 56 IO |
| Number of UARTs | 2 UART |
| Number of ADCs | 1 ADC |
| Number of Inputs and Outputs | 56 IO |
| Operating Temperature (Max) | 85 ℃ |
| Operating Temperature (Min) | -40 ℃ |
| Show | |
| Operating Temperature | -40℃ ~ 85℃ |
| Product Lifecycle Status | Active |
| Packaging | Tray |
| RoHS | Non-Compliant |
| Lead-Free Status | Contains Lead |
| REACH SVHC Compliance | No SVHC |
| REACH SVHC Compliance Edition | 2018/06/27 |
| ECCN Code | 3A991.a.2 |
Order guide
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- - Carefully inspected and packed by ManyChip warehouse - Vacuum packaging - Anti-static packaging - Shockproof foam
- The terms here are for reference only, the actual terms are subject to the sales quotation. - Please confirm product specifications when ordering. - MOQ refers to the minimum order quantity required to purchase each part. - If you have special ordering instructions, please indicate them on the ordering page. - Inspection (PSI) will be performed prior to shipment.
- - Income Quality Control (IQC), 1000+ qualified dealers. - Chips are tested by authoritative organizations to ensure the quality, authenticity and safety of your device. - Decapsulation control - X-ray control - XRF inspection - Electrical testing - Surface testing -Digital components warehouse, covering an area of 800 square meters, with constant temperature and humidity
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