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Updated at 17/06/2025 10:30:15(UTC+8)
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Description
- Overview
- The BGU7258 is a fully integrated MMIC Low Noise Amplifier (LNA) for wireless receiver applications in the 5 GHz to 6 GHz ISM band. Manufactured in NXP’s high performance SiGe:C technology, the BGU7258 couples best-in-class gain, noise figure, linearity and efficiency with the process stability and ruggedness that are the hallmarks of SiGe technology. The BGU7258 features a robust temperature-compensated internal bias network and an integral bypass / shutdown feature that stabilizes the DC operating point over temperature and enables operation in the presence of high input signals, while minimizing current consumption in bypass (standby) mode. The 1.6 mm x 1.6 mm footprint coupled with only two external components, makes the circuit board implementation of the BGU7258 LNA the smallest IEEE 802.11ac LNA with bypass solution on the market, ideal for space sensitive applications.
- MoreLess
- ## Features
- * Fully integrated, high performance LNA with built-in bypass
- * Integrated DC blocking at RF input and RF output, with only two external components needed
- * Low 1.6 dB noise figure with 13 mA current consumption
- * Low bypass current of 1 μA (typical)
- * Single supply 3.0 V to 3.6 V operation
- * Integrated concurrent 2.4 GHz notch filter and temperature stabilized bias network
- * High IP3i and low EVM
- * High ESD protection of 2 kV (HBM) on all pins
- * Small, 0.5 mm pitch, 1.6 mm x 1.6 mm x 0.5 mm QFN-style package, MSL 1 at 260 °C
- * Compliant to Directive 2002/95/EC, regarding Restriction of Hazardous Substances (RoHS) following NXP’s RHF-2006 indicator D (dark green)
- ## Target Applications
- * IEEE 802.11a/n/ac WiFi, WLAN
- * Smartphones, tablets, netbooks and other portable computing devices
- * Access points, routers, gateways
- * Wireless video
- * LTE advanced in unlicensed spectrum (LTE-U)
- * General purpose ISM applications
- ## Features
BGU7258 Specifications
| Attribute | Attribute Value |
|---|---|
| Datasheet | Datasheet |
| 3D Model | 3D Model |
| Case/Package | HXSON-6 |
| Show | |
| Product Lifecycle Status | Active |
| RoHS | RoHS Compliant |
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- - Carefully inspected and packed by ManyChip warehouse - Vacuum packaging - Anti-static packaging - Shockproof foam
- The terms here are for reference only, the actual terms are subject to the sales quotation. - Please confirm product specifications when ordering. - MOQ refers to the minimum order quantity required to purchase each part. - If you have special ordering instructions, please indicate them on the ordering page. - Inspection (PSI) will be performed prior to shipment.
- - Income Quality Control (IQC), 1000+ qualified dealers. - Chips are tested by authoritative organizations to ensure the quality, authenticity and safety of your device. - Decapsulation control - X-ray control - XRF inspection - Electrical testing - Surface testing -Digital components warehouse, covering an area of 800 square meters, with constant temperature and humidity
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