Чип модуля WLAN+BT, соответствующий стандартам IEEE 802.11B/g/n, с поддержкой Bluetooth v4.0 (BLE) и режима EDR; используется в качестве модуля SIP SMD с 100 контактами.

| Attribute | Attribute Value |
|---|---|
| Datasheet | Datasheet |
| 3D Model | 3D Model |
| Mounting Style | Surface Mount |
| Number of Pins | 130 Pin |
| Case/Package | FLGA-130 |
| Frequency | 2.4 GHz |
| Output Power | 17.3 dBm |
| Supply Voltage | 2.9V ~ 4.8V |
| Show | |
| Operating Temperature | -20℃ ~ 70℃ |
| Product Lifecycle Status | Active |
| Packaging | Cut Tape (CT) |
| RoHS | RoHS Compliant |
| Lead-Free Status | Lead Free |
| REACH SVHC Compliance Edition | 2015/06/15 |
| HK STC License | NLR |