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BGA614H6327XTSA1 - Infineon
Manufacturer:
Infineon
ManyChip's Part#:
MC6089742
Category:
Amplifier chip
Package:
SOT-343-4
Datasheet:
Datasheet 3D Model
Description:
Wide Band Low Power, 0MHz Min, 2400MHz Max, ROHS COMPLIANT, SOT-343, 4Pin
Stock Locations:
Availability:
5,489 pcs In Stock
MOQ:
1 pcs
Unit Price:
$ 0.25

Updated at 01/11/2025 10:30:15(UTC+8)

Certifications

ManyChip is committed to product quality and safety with ISO 9001, ISO 13485, ISO 45001, UL, RoHS, CQC and REACH certifications.

Description

The BGA 614 H6327 is a general purpose Silicon Germanium Broadband MMIC Amplifier in a Darlington configuration. It is optimized for a typical supply current of 40mA. The low noise amplifier is as flexible as a discrete transistor and offers numerous integrated features for smaller and thinner mobile device designs. The device perfectly fits to the embedded FM radio active antennas in cellular phones (mobile FM radio).
Cascadable 50R gain block
Compression point P-1dB = 12dBm at 2.0GHz
Absolute stable
70GHz fT - Silicon Germanium technology
1kV HBM ESD protection (pin-to-pin)

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BGA614H6327XTSA1 Specifications

Attribute	Attribute Value

Datasheet	Datasheet
3D Model	3D Model
Mounting Style	Surface Mount
Number of Pins	4 Pin
Case/Package	SOT-343-4
Frequency	0Hz ~ 2.4GHz
Number of Channels	1 Channel
Number of Positions	4 Position
Power Dissipation	0.24 W
Output Power	12 dBm
Gain	17.5 dB
Test Frequency	1 GHz
Operating Temperature (Max)	150 ℃
Operating Temperature (Min)	-65 ℃
3dB Bandwidth	2400 MHz
Power Dissipation (Max)	240 mW
Supply Voltage (Max)	3 V
	Show
Size-Length	2 mm
Size-Width	1.25 mm
Size-Height	0.9 mm
Product Lifecycle Status	Active
Packaging	Tape & Reel (TR)
RoHS	RoHS Compliant
Lead-Free Status	Lead Free
REACH SVHC Compliance	No SVHC
REACH SVHC Compliance Edition	2015/12/17

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- Carefully inspected and packed by ManyChip warehouse
- Vacuum packaging
- Anti-static packaging
- Shockproof foam
The terms here are for reference only, the actual terms are subject to the sales quotation.
- Please confirm product specifications when ordering.
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- Decapsulation control
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- XRF inspection
- Electrical testing
- Surface testing
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