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- FSL306LRLX - ON Semiconductor
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Manufacturer:ON Semiconductor
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ManyChip's Part#:MC59652130
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Category:PWM Controller IC
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Package:DIP-8
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Datasheet:Datasheet 3D Model
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Description:650V Integrated Power Switch with Error Amplifier and no bias winding for 3W offline buck converters
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Stock Locations:
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Availability:266 pcs In Stock
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MOQ:1 pcs
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Unit Price:$ 0.95
Updated at 17/06/2025 10:30:15(UTC+8)
Certifications
ManyChip is committed to product quality and safety with ISO 9001, ISO 13485, ISO 45001, UL, RoHS, CQC and REACH certifications.
Description
- The FSL306LR integrate Pulse Width Modulator (PWM) and SenseFET is specifically designed for high-performance offline buck, buck-boost, and non-isolation flyback Switched Mode Power Supplies (SMPS) with minimal external components. This device integrates a high-voltage power regulator that enables operation without auxiliary bias winding. An internal transconductance amplifier reduces external components for the feedback compensation circuit.The integrated PWM controller includes: 10 V regulator for no external bias circuit, Under-Voltage Lockout (UVLO), Leading-Edge Blanking (LEB), an optimized gate turn-on / turn-off driver, EMI attenuator, Thermal Shutdown (TSD), temperature-compensated precision current sources for loop compensation, and fault-protection circuitry. Protections include: Overload Protection (OLP), Over-Voltage Protection (OVP), Feedback Open Loop Protection (FB_OLP), and Abnormal Over-Current Protection (AOCP). FSL306LRN offers good soft-start performance during startup.The internal high-voltage startup switch and the Burst-Mode operation with very low operating current reduce the power loss in Standby Mode. As the result, it is possible to reach power loss of 120 mW without external bias and 25 mW with external bias when input voltage is 230 V
- Features
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- Built-in Avalanche Rugged SenseFET: 650 V
- Fixed Operating Frequency: 50 kHz
- No-Load Power Consumption: < 25 mW at 230 VAC with External Bias; <120 mW at 230 VAC without External Bias
- No Need for Auxiliary Bias Winding
- Frequency Modulation for Attenuating EMI
- Pulse-by-Pulse Current Limiting
- Ultra-Low Operating Current: 250 µA
- Built-in Soft-Start and Startup Circuit
- Adjustable Peak Current Limit
- Built-in Transconductance (Error) Amplifier
- Various Protections: Overload Protection (OLP), Over-Voltage Protection (OVP), Feedback Open Loop Protection (FB_OLP), AOCP (Abnormal Over-Current Protection), Thermal Shutdown (TSD)
- Fixed 650 ms Restart Time for Safe Auto-Restart Mode of All Protections
FSL306LRLX Specifications
| Attribute | Attribute Value |
|---|---|
| Datasheet | Datasheet |
| 3D Model | 3D Model |
| Mounting Style | Surface Mount |
| Number of Pins | 7 Pin |
| Case/Package | DIP-8 |
| Power Rating | 7 W |
| Number of Outputs | 1 Output |
| Output Voltage | 12 V |
| Output Current | 150 mA |
| Breakdown Voltage | 650 V |
| Rise Time | 7.6 ns |
| Switching Frequency | 50 kHz |
| Thermal Resistance | 100 ℃/W |
| Fall Time | 26.1 ns |
| Operating Temperature (Max) | 125 ℃ |
| Operating Temperature (Min) | -40 ℃ |
| Supply Voltage | 7V ~ 26V |
| Input Voltage | 230 V |
| Show | |
| Size-Length | 9.4 mm |
| Size-Width | 6.6 mm |
| Size-Height | 3.6 mm |
| Operating Temperature | -40℃ ~ 125℃ (TJ) |
| Product Lifecycle Status | Active |
| Packaging | Tape & Reel (TR) |
| RoHS | RoHS Compliant |
| Lead-Free Status | Lead Free |
| ECCN Code | EAR99 |
Order guide
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- Delivery date: usually 2 to 7 working days.
- A tracking number will be sent after your order ships.
- - Carefully inspected and packed by ManyChip warehouse - Vacuum packaging - Anti-static packaging - Shockproof foam
- The terms here are for reference only, the actual terms are subject to the sales quotation. - Please confirm product specifications when ordering. - MOQ refers to the minimum order quantity required to purchase each part. - If you have special ordering instructions, please indicate them on the ordering page. - Inspection (PSI) will be performed prior to shipment.
- - Income Quality Control (IQC), 1000+ qualified dealers. - Chips are tested by authoritative organizations to ensure the quality, authenticity and safety of your device. - Decapsulation control - X-ray control - XRF inspection - Electrical testing - Surface testing -Digital components warehouse, covering an area of 800 square meters, with constant temperature and humidity
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