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- LPC4370FET100E - NXP
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Manufacturer:NXP
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ManyChip's Part#:MC47810258
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Category:Microcontroller, MCU IC
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Package:TFBGA-100
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Datasheet:Datasheet 3D Model
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Description:32Bit ARM Cortex-M4 + 2 x M0 MCU; 282KB SRAM; Ethernet; two HS USBs; 80MSPS 12Bit ADC; configurable peripherals
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Stock Locations:
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Availability:4,597 pcs In Stock
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MOQ:1 pcs
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Unit Price:$ 24.2
Updated at 01/11/2025 10:30:15(UTC+8)
Certifications
ManyChip is committed to product quality and safety with ISO 9001, ISO 13485, ISO 45001, UL, RoHS, CQC and REACH certifications.
Description
- * Main Cortex-M4 processor: * ARM Cortex-M4 processor, running at frequencies of up to 204 MHz * ARM Cortex-M4 built-in Memory Protection Unit (MPU) supporting eight regions * ARM Cortex-M4 built-in Nested Vectored Interrupt Controller (NVIC) * Hardware floating-point unit * Non-maskable Interrupt (NMI) input * JTAG and Serial Wire Debug (SWD), serial trace, eight breakpoints, and four watchpoints * Enhanced Trace Module (ETM) and Enhanced Trace Buffer (ETB) support * System tick timer * Cortex-M0 coprocessor: * ARM Cortex-M0 coprocessor capable of off-loading the main ARM Cortex-M4processor * Running at frequencies of up to 204 MHz * JTAG and built-in NVIC * Cortex-M0 subsystem: * ARM Cortex-M0 processor controlling the SPI and SGPIO peripherals residing ona separate AHB multilayer matrix with direct access to 2 kB + 16 kB of SRAM * Running at frequencies of up to 204 MHz * Connected via a core-to-core bridge to the main AHB multilayer matrix and themain ARM Cortex-M4 processor * JTAG and built-in NVIC * On-chip memory: * 264 kB SRAM for code and data use on the main AHB multilayer matrix plus 18 kBof SRAM on the Cortex-M0 subsystem * Multiple SRAM blocks with separate bus access. Two SRAM blocks can bepowered down individually * 64 kB ROM containing boot code and on-chip software drivers * 64-bit + 256 bit general-purpose One-Time Programmable (OTP) memory * Configurable digital peripherals: * Serial GPIO (SGPIO) interface * State Configurable Timer (SCT) subsystem on AHB * Global Input Multiplexer Array (GIMA) allows to cross-connect multiple inputs andoutputs to event driven peripherals like the timers, SCT, and ADC0/1 * Serial interfaces: * Quad SPI Flash Interface (SPIFI) with four lanes and up to 52 MB per second * 10/100T Ethernet MAC with RMII and MII interfaces and DMA support for highthroughput at low CPU load. Support for IEEE 1588 time stamping/advanced timestamping (IEEE 1588-2008 v2) * One High-speed USB 2.0 Host/Device/OTG interface with DMA support andon-chip high-speed PHY * One High-speed USB 2.0 Host/Device interface with DMA support, on-chipfull-speed PHY and ULPI interface to external high-speed PHY * USB interface electrical test software included in ROM USB stack * One 550 UART with DMA support and full modem interface * Three 550 USARTs with DMA and synchronous mode support and a smart cardinterface conforming to ISO7816 specification. One USART with IrDA interface * Two C_CAN 2.0B controllers with one channel each. Use of C_CAN controllerexcludes operation of all other peripherals connected to the same bus bridge * Two SSP controllers with FIFO and multi-protocol support. Both SSPs with DMAsupport * One SPI controller * One Fast-mode Plus I²C-bus interface with monitor mode and open-drain I/Opins conforming to the full I²C-bus specification. Supports data rates of up to1 Mbit/s * One standard I²C-bus interface with monitor mode and with standard I/O pins * Two I²S interfaces, each with DMA support and with one input and one output * Digital peripherals: * External Memory Controller (EMC) supporting external SRAM, ROM, NOR flash,and SDRAM devices * LCD controller with DMA support and a programmable display resolution of up to1024 H x768 V. Supports monochrome and color STN panels and TFT colorpanels; supports 1/2/4/8 bpp Color Look-Up Table (CLUT) and 16/24-bit direct pixelmapping * Secure Digital Input Output (SD/MMC) card interface * Eight-channel General-Purpose DMA (GPDMA) controller can access all memorieson the AHB and all DMA-capable AHB slaves * 164 General-Purpose Input/Output (GPIO) pins with configurable pull-up/pull-downresistors and open-drain mode
LPC4370FET100E Specifications
| Attribute | Attribute Value |
|---|---|
| Datasheet | Datasheet |
| 3D Model | 3D Model |
| Mounting Style | Surface Mount |
| Number of Pins | 100 Pin |
| Case/Package | TFBGA-100 |
| Frequency | 204 MHz |
| Number of Positions | 100 Position |
| RAM Memory Size | 282K x 8 |
| Number of Bits | 32 Bit |
| Number of ADCs | 2 ADC |
| Number of Inputs and Outputs | 49 Input IO |
| Operating Temperature (Max) | 85 ℃ |
| Operating Temperature (Min) | -40 ℃ |
| Power Dissipation (Max) | 1500 mW |
| Number of DACs | 1 DAC |
| Supply Voltage | 2.2V ~ 3.6V |
| Supply Voltage (Max) | 3.6 V |
| Supply Voltage (Min) | 2.2 V |
| Show | |
| Operating Temperature | -40℃ ~ 85℃ |
| Product Lifecycle Status | Active |
| Packaging | Tray |
| RoHS | RoHS Compliant |
| Lead-Free Status | Lead Free |
Order guide
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- - Carefully inspected and packed by ManyChip warehouse - Vacuum packaging - Anti-static packaging - Shockproof foam
- The terms here are for reference only, the actual terms are subject to the sales quotation. - Please confirm product specifications when ordering. - MOQ refers to the minimum order quantity required to purchase each part. - If you have special ordering instructions, please indicate them on the ordering page. - Inspection (PSI) will be performed prior to shipment.
- - Income Quality Control (IQC), 1000+ qualified dealers. - Chips are tested by authoritative organizations to ensure the quality, authenticity and safety of your device. - Decapsulation control - X-ray control - XRF inspection - Electrical testing - Surface testing -Digital components warehouse, covering an area of 800 square meters, with constant temperature and humidity
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