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- OMAPL138BZCE3 - TI
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Manufacturer:TI
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ManyChip's Part#:MC93748611
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Category:Microprocessor IC
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Package:NFBGA-361
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Datasheet:Datasheet 3D Model
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Description:0-BIT, 50MHz, OTHER DSP, PBGA361, 13 X 13MM, 0.65MM PITCH, GREEN, PLASTIC, NFBGA-361
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Stock Locations:
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Availability:269 pcs In Stock
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MOQ:1 pcs
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Unit Price:$ 45.22
Updated at 17/06/2025 10:30:15(UTC+8)
Certifications
ManyChip is committed to product quality and safety with ISO 9001, ISO 13485, ISO 45001, UL, RoHS, CQC and REACH certifications.
Description
- The OMAP-L1X series DSP+ARM® low-power Applications Processor based on an ARM926EJ-S and a C674x DSP core. This processor provides significantly lower power than other members of the TMS320C6000™ platform of DSPs. The device enables original-equipment manufacturers (OEMs) and original-design manufacturers (ODMs) to quickly bring to market devices with robust operating systems, rich user interfaces and high processor performance through the maximum flexibility of a fully integrated, mixed processor solution. The dual-core architecture of the device provides benefits of both DSP and reduced instruction set computer (RISC) technologies, incorporating a high-performance TMS320C674x DSP core and an ARM926EJ-S core. The ARM926EJ-S is a 32-bit RISC processor core that performs 32- or 16-bit instructions and processes 32-, 16- or 8-bit data. The core uses pipelining so that all parts of the processor and memory system can operate continuously.
- 375- and 456MHz ARM926EJ-S™ RISC MPU
- ARM926EJ-S core - 32- and 16-bit (Thumb®) instructions and DSP instruction extensions
- 16kB Instruction cache and data cache
- 8kB RAM (vector table)
- 64kB ROM
- C674x instruction set feature - Superset of the C67x+ and C64x+ ISAs
- C674x two-level cache memory architecture
- Enhanced direct memory access controller 3 (EDMA3)
- TMS320C674x floating-point VLIW DSP core
- Supports up to four SP additions per clock and four DP additions every two clocks
- Two multiply functional units
- Hardware support for modulo loop operation
- Protected mode operation
- Exceptions support for error detection and program redirection
- Software support - TI DSP BIOS™, chip support library and DSP library
- 128kB RAM shared memory
- Three configurable 16550-type UART modules
- LCD controller
- Two serial peripheral interfaces (SPIs) each with multiple chip selects
- One host-port interface (HPI) with 16-bit-wide Muxed address and data bus for high bandwidth
OMAPL138BZCE3 Specifications
| Attribute | Attribute Value |
|---|---|
| Datasheet | Datasheet |
| 3D Model | 3D Model |
| Number of Pins | 361 Pin |
| Case/Package | NFBGA-361 |
| Frequency | 456 MHz |
| Number of Positions | 361 Position |
| Clock Speed | 375456 MHz |
| RAM Memory Size | 8 KB |
| Number of Bits | 32 Bit |
| Number of UARTs | 3 UART |
| Number of Inputs and Outputs | 16 Input IO |
| Operating Temperature (Max) | 90 ℃ |
| Operating Temperature (Min) | 0 ℃ |
| Show | |
| Size-Height | 0.94 mm |
| Operating Temperature | 0℃ ~ 90℃ (TJ) |
| Product Lifecycle Status | Active |
| Packaging | Cut Tape (CT) |
| RoHS | RoHS Compliant |
| Lead-Free Status | Lead Free |
| REACH SVHC Compliance | No SVHC |
| REACH SVHC Compliance Edition | 2015/06/15 |
Order guide
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- Please confirm with the logistics company in advance for remote areas.
(Additional charges ($35-$50) may apply for delivery in these areas)
- Delivery date: usually 2 to 7 working days.
- A tracking number will be sent after your order ships.
- - Carefully inspected and packed by ManyChip warehouse - Vacuum packaging - Anti-static packaging - Shockproof foam
- The terms here are for reference only, the actual terms are subject to the sales quotation. - Please confirm product specifications when ordering. - MOQ refers to the minimum order quantity required to purchase each part. - If you have special ordering instructions, please indicate them on the ordering page. - Inspection (PSI) will be performed prior to shipment.
- - Income Quality Control (IQC), 1000+ qualified dealers. - Chips are tested by authoritative organizations to ensure the quality, authenticity and safety of your device. - Decapsulation control - X-ray control - XRF inspection - Electrical testing - Surface testing -Digital components warehouse, covering an area of 800 square meters, with constant temperature and humidity
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