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- S25FL256SAGMFV001 - Cypress Semiconductor
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Manufacturer:Cypress Semiconductor
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ManyChip's Part#:MC62498793
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Category:Flash Memory
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Package:SOIC-16
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Datasheet:Datasheet 3D Model
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Description:NOR-флешный последовательный интерфейс (SPI, Dual SPI, Quad SPI), напряжение 3V/3.3В, объем памяти 256 Мбит, размеры каналов x 1/2Бит/4Бит, время передачи данных 8 нс, форма корпуса SOIC W, количество контактов – 16.
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Stock Locations:
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Availability:300 pcs In Stock
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MOQ:1 pcs
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Unit Price:$ 0.33
Updated at 01/11/2026 10:30:15(UTC+8)
Certifications
ManyChip is committed to product quality and safety with ISO 9001, ISO 13485, ISO 45001, UL, RoHS, CQC and REACH certifications.
Description
- FLASH-NOR-памятьный чип, объем памяти 256 Мб (32 Мб x 8), интерфейс SPI, тип I/O – Quad I/O, частота работы 133 МГц, форма корпуса 16-SOIC.
S25FL256SAGMFV001 Specifications
| Attribute | Attribute Value |
|---|---|
| Datasheet | Datasheet |
| 3D Model | 3D Model |
| Mounting Style | Surface Mount |
| Number of Pins | 16 Pin |
| Case/Package | SOIC-16 |
| Number of Positions | 16 Position |
| Clock Speed | 133 MHz |
| Access Time(Max) | 8 ns |
| Operating Temperature (Max) | 105 ℃ |
| Operating Temperature (Min) | -40 ℃ |
| Supply Voltage | 2.7V ~ 3.6V |
| Supply Voltage (Max) | 3.6 V |
| Supply Voltage (Min) | 2.7 V |
| Show | |
| Operating Temperature | -40℃ ~ 105℃ (TA) |
| Product Lifecycle Status | Unknown |
| Packaging | Tube |
| RoHS | RoHS Compliant |
| Lead-Free Status |
Order guide
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- - Carefully inspected and packed by ManyChip warehouse - Vacuum packaging - Anti-static packaging - Shockproof foam
- The terms here are for reference only, the actual terms are subject to the sales quotation. - Please confirm product specifications when ordering. - MOQ refers to the minimum order quantity required to purchase each part. - If you have special ordering instructions, please indicate them on the ordering page. - Inspection (PSI) will be performed prior to shipment.
- - Income Quality Control (IQC), 1000+ qualified dealers. - Chips are tested by authoritative organizations to ensure the quality, authenticity and safety of your device. - Decapsulation control - X-ray control - XRF inspection - Electrical testing - Surface testing -Digital components warehouse, covering an area of 800 square meters, with constant temperature and humidity
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