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Updated at 17/06/2025 10:30:15(UTC+8)
Certifications
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Description
- Programmable Controllers AC / DC−Input Module Telecommunication
- The TOSHIBA TLP626, −2 and −4 consist of gallium arsenide infrared emitting diodes connected in inverse parallel, optically coupled to a photo−transistor. The TLP626−2 offers two isolated channels in an eight lead plastic DIP, while the TLP626−4 provides four isolated channels in a sixteen plastic DIP.
- • Collector−emitter voltage: 55V(min.)
- • Current transfer ratio
- • Isolation voltage: 5000Vrms min.
- • UL recognized: UL1577, file no.E67349
- • BSI approved: BS EN60065: 2002 certificate no.7426
- BS EN60950-1: 2002 certificate no.7427
- • Note: Application type name for certification test,
- please use standard product type name, i.e.
- TLP626(BV): TLP626
TLP626 Specifications
| Attribute | Attribute Value |
|---|---|
| Datasheet | Datasheet |
| 3D Model | 3D Model |
| Mounting Style | Through Hole |
| Number of Pins | 4 Pin |
| Case/Package | DIP |
| Input Voltage (DC) | 1.15 V |
| Output Voltage | ≤55.0 V |
| Number of Circuits | 1 Circuit |
| Number of Channels | 1 Channel |
| Forward Voltage | 1.15 V |
| Power Dissipation | 250 mW |
| Rise Time | 8 µs |
| Maximum Forward Voltage (Max) | 1.3 V |
| Forward Current (Max) | 60 mA |
| Fall Time | 8 µs |
| Operating Temperature (Max) | 75 ℃ |
| Operating Temperature (Min) | -25 ℃ |
| Power Dissipation (Max) | 250 mW |
| Show | |
| Product Lifecycle Status | Not Recommended |
| Packaging | Tube |
| RoHS | Non-Compliant |
| Lead-Free Status | Contains Lead |
| ECCN Code | EAR99 |
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- - Carefully inspected and packed by ManyChip warehouse - Vacuum packaging - Anti-static packaging - Shockproof foam
- The terms here are for reference only, the actual terms are subject to the sales quotation. - Please confirm product specifications when ordering. - MOQ refers to the minimum order quantity required to purchase each part. - If you have special ordering instructions, please indicate them on the ordering page. - Inspection (PSI) will be performed prior to shipment.
- - Income Quality Control (IQC), 1000+ qualified dealers. - Chips are tested by authoritative organizations to ensure the quality, authenticity and safety of your device. - Decapsulation control - X-ray control - XRF inspection - Electrical testing - Surface testing -Digital components warehouse, covering an area of 800 square meters, with constant temperature and humidity
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