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- MSP430FR2110IPW16R - TI
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Manufacturer:TI
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ManyChip's Part#:MC55397289
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Category:Microcontroller, MCU IC
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Package:TSSOP-16
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Datasheet:Datasheet 3D Model
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Description:16Bit Microcontrollers - MCU 16MHz Ultra-Low-Power Microcontroller With 2KB FRAM, 1KB SRAM, 12 IO, 8CH ADC10 16-TSSOP -40℃ to 85℃
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Stock Locations:
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Availability:2,146 pcs In Stock
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MOQ:1 pcs
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Unit Price:$ 2.39
Updated at 17/06/2025 10:30:15(UTC+8)
Certifications
ManyChip is committed to product quality and safety with ISO 9001, ISO 13485, ISO 45001, UL, RoHS, CQC and REACH certifications.
Description
- MSP430FR2000 and MSP430FR21xx devices are part of the MSP430™ microcontroller (MCU) value line sensing portfolio. This ultra-low-power, low-cost MCU family offers memory sizes from 0.5KB to 4KB of FRAM unified memory with several package options including a small 3-mm×3-mm VQFN package. The architecture, FRAM, and integrated peripherals, combined with extensive low-power modes, are optimized to achieve extended battery life in portable, battery-powered sensing applications. MSP430FR2000 and MSP430FR21xx devices offer a migration path for 8-bit designs to gain additional features and functionality from peripheral integration and the data-logging and low-power benefits of FRAM. Additionally, existing designs using MSP430G2x MCUs can migrate to the MSP430FR2000 and MSP430F21xx family to increase performance and get the benefits of FRAM.
- The MSP430FR2000 and MSP430FR21xx MCUs feature a powerful 16-bit RISC CPU, 16-bit registers, and a constant generator that contribute to maximum code efficiency. The digitally controlled oscillator (DCO) also allows the device to wake up from low-power modes to active mode typically in less than 10 µs. The feature set of this MCU meets the needs of applications ranging from appliance battery packs and battery monitoring to smoke detectors and fitness accessories.
- The MSP ultra-low-power (ULP) FRAM microcontroller platform combines uniquely embedded FRAM and a holistic ultra-low-power system architecture, allowing system designers to increase performance while lowering energy consumption. FRAM technology combines the low-energy fast writes, flexibility, and endurance of RAM with the nonvolatile behavior of flash.
- MSP430FR2000 and MSP430FR21x MCUs are supported by an extensive hardware and software ecosystem with reference designs and code examples to get your design started quickly. Development kits include the MSP-EXP430FR2311 and MSP430FR4133 LaunchPad™ development kit and the MSP‑TS430PW20 20-pin target development board. TI also provides free MSP430Ware™ software, which is available as a component of Code Composer Studio™ IDE desktop and cloud versions within TI Resource Explorer. The MSP430 MCUs are also supported by extensive online collateral, training, and online support through the E2E™ Community Forum.
MSP430FR2110IPW16R Specifications
| Attribute | Attribute Value |
|---|---|
| Datasheet | Datasheet |
| 3D Model | 3D Model |
| Mounting Style | Surface Mount |
| Number of Pins | 16 Pin |
| Case/Package | TSSOP-16 |
| Frequency | 16.0 MHz |
| Clock Speed | 16.0 MHz |
| RAM Memory Size | 1K x 8 |
| Number of UARTs | 1 UART |
| Number of ADCs | 1 ADC |
| Operating Temperature (Max) | 85 ℃ |
| Operating Temperature (Min) | 40 ℃ |
| Show | |
| Operating Temperature | -40℃ ~ 85℃ (TA) |
| Product Lifecycle Status | Active |
| Packaging | Tape & Reel (TR) |
| RoHS | RoHS Compliant |
| Lead-Free Status | |
| ECCN Code | EAR99 |
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- - Carefully inspected and packed by ManyChip warehouse - Vacuum packaging - Anti-static packaging - Shockproof foam
- The terms here are for reference only, the actual terms are subject to the sales quotation. - Please confirm product specifications when ordering. - MOQ refers to the minimum order quantity required to purchase each part. - If you have special ordering instructions, please indicate them on the ordering page. - Inspection (PSI) will be performed prior to shipment.
- - Income Quality Control (IQC), 1000+ qualified dealers. - Chips are tested by authoritative organizations to ensure the quality, authenticity and safety of your device. - Decapsulation control - X-ray control - XRF inspection - Electrical testing - Surface testing -Digital components warehouse, covering an area of 800 square meters, with constant temperature and humidity
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