* DPAK Package Offers Smaller Footprint for Increased Board Space * Gate-Emitter ESD Protection * Temperature Compensated Gate-Collector Voltage Clamp Limits Stress Applied to Load * Intergrated ESD Diode Protection * Low Threshold Voltage for Interfacing Power Loads to Logic or Microprocessor Devices * Low Saturation Voltage * High Pulsed Current Capability * Optional Gate Resistor (RG) and Gate-Emitter Resistor (RGE) * Pb-Free Package is Avialable
| Attribute | Attribute Value |
|---|---|
| Datasheet | Datasheet |
| 3D Model | 3D Model |
| Mounting Style | Surface Mount |
| Number of Pins | 3 Pin |
| Case/Package | TO-252-3 |
| Halogen Free Status | Halogen Free |
| Number of Positions | 3 Position |
| Power Dissipation | 125 W |
| Breakdown Voltage (Collector to Emitter) | 440 V |
| Input Power (Max) | 125 W |
| Operating Temperature (Max) | 175 ℃ |
| Operating Temperature (Min) | -55 ℃ |
| Power Dissipation (Max) | 125 W |
| Show | |
| Size-Length | 6.73 mm |
| Size-Width | 7.49 mm |
| Size-Height | 2.38 mm |
| Operating Temperature | -55℃ ~ 175℃ (TJ) |
| Product Lifecycle Status | Active |
| Packaging | Tape & Reel (TR) |
| RoHS | RoHS Compliant |
| Lead-Free Status | Lead Free |
| REACH SVHC Compliance Edition | 2015/12/17 |