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- TMDSEVM6670L - TI
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Manufacturer:TI
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ManyChip's Part#:MC107145993
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Category:Microprocessor Primary Platform
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Datasheet:Datasheet 3D Model
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Description:TMS320C6670 DSP Evaluation Board 512Mb RAM 128KB/128Mb I2C EEPROM/NAND Flash Win 95/Win 98/Win NT
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Stock Locations:
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Availability:10 pcs In Stock
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MOQ:1 pcs
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Unit Price:$ 568.43
Updated at 17/06/2025 10:30:15(UTC+8)
Certifications
ManyChip is committed to product quality and safety with ISO 9001, ISO 13485, ISO 45001, UL, RoHS, CQC and REACH certifications.
Description
- TMDSEVM6670L | TMDSEVM6670LE | TMDSEVM6670LXE
- **TMDSEVM6670L** \\- TMS320C6670 Lite Evaluation Module
- The TMS320C6670 Lite Evaluation Module (EVM), or TMDSEVM6670L, is an easy-to-use, cost-efficient development tool that is designed to help developers quickly get started with designs using the C6670 multicore DSP. It includes an on-board, single C6670 processor with robust connectivity options that allows customers to use an AMC form factor card in various systems. It also works as a stand alone board.
- The TMDSEVM6670L EVM comes with XDS100 embedded emulation capability. In addition, an external emulator via JTAG emulation header can be also be used. Software accompanying the 6670L EVM includes Code Composer Studio Studio™ version 4.2 (CSv4.2), Board Support Package (BSP), Chip Support Library (CSL), Power On Self Test (POST), Network Development Kit (NDK), and Out of Box (OOB) Demonstration SW.
- The TMDSEVM6670L EVM is designed for an ease of use environment to evaluate the features & functions of the multicore C6670 DSP. The emulation capability and software included in the EVM will allow customer to program the C6670 DSP to benchmark the algorithms that are intended to be implemented on C6670 DSP.
- **TMDSEVM6670LE** \\- TMS320C6670 Lite Evaluation Module with XDS560V2 Emulation
- The TMDSEVM6670LE Lite Evaluation Module (EVM) is an easy-to-use, cost-efficient development tool that is designed to help developers quickly get started with designs using the C6670 multicore DSP. It includes an on-board, single C6670 processor with robust connectivity options that allows customers to use this AMC form factor card in various systems. It also works as a stand alone board.
- The TMDSEVM6670LE EVM comes with XDS560V2 embedded emulation capability. The software accompanying the 6670LE EVM includes Code Composer Studio Studio™ version 4.2 (CSv4.2), Board Support Package (BSP), Chip Support Library (CSL), Power On Self Test (POST), Network Development Kit (NDK), and Out of Box (OOB) Demonstration SW.
- The TMDSEVM6670LE EVM is designed for an ease of use environment to evaluate the features & functions of the C6670 multicore DSP. The emulation capability and software included in the EVM will allow customer to program the C6670 DSP to benchmark the algorithms that are intended to be implemented on C6670 DSP.
- **NOTE:** The TMDSEVM6670LE is expected to be available in September 2011.
- **TMDSEVM6670LXE** \\- TMS320C6670 Lite Evaluation Module with Encryption and XDS560V2
- The TMDSEVM6670LXE Lite Evaluation Module (EVM) is an easy-to-use, cost-efficient development tool that is designed to help developers quickly get started with designs using the C6670 multicore DSP. It includes an on-board, single C6670 processor with robust connectivity options that allows customers to use this AMC form factor card in various systems. It also works as a stand alone board.
- The TMDSEVM6670LXE EVM has*encryption enabled** and comes with **XDS560V2 embedded emulation capability**. The software accompanying the 6670LE EVM includes Code Composer Studio Studio™ version 4.2 (CSv4.2), Board Support Package (BSP), Chip Support Library (CSL), Power On Self Test (POST), Network Development Kit (NDK), and Out of Box (OOB) Demonstration SW.
- The TMDSVM6670LXE EVM is designed for an ease of use environment to evaluate the features & functions of the multicore C6670 DSP. The emulation capability and software included in the EVM will allow customer to program the C6670 DSP to benchmark the algorithms that are intended to be implemented on C6670 DSP.
- **NOTE:** Please contact your **local TI sales representative** to request the TMDSEVM6670LXE.
TMDSEVM6670L Specifications
| Attribute | Attribute Value |
|---|---|
| Datasheet | Datasheet |
| 3D Model | 3D Model |
| RAM Memory Size | 512 MB |
| Show | |
| Product Lifecycle Status | Unknown |
| RoHS | RoHS Compliant |
| Lead-Free Status | Lead Free |
| HK STC License | NLR |
Order guide
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(Additional charges ($35-$50) may apply for delivery in these areas)
- Delivery date: usually 2 to 7 working days.
- A tracking number will be sent after your order ships.
- - Carefully inspected and packed by ManyChip warehouse - Vacuum packaging - Anti-static packaging - Shockproof foam
- The terms here are for reference only, the actual terms are subject to the sales quotation. - Please confirm product specifications when ordering. - MOQ refers to the minimum order quantity required to purchase each part. - If you have special ordering instructions, please indicate them on the ordering page. - Inspection (PSI) will be performed prior to shipment.
- - Income Quality Control (IQC), 1000+ qualified dealers. - Chips are tested by authoritative organizations to ensure the quality, authenticity and safety of your device. - Decapsulation control - X-ray control - XRF inspection - Electrical testing - Surface testing -Digital components warehouse, covering an area of 800 square meters, with constant temperature and humidity
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